Invenios has developed various proprietary techniques for the integration of electrical leads in chips made by combining materials like glass, silicon or plastic. Invenios low temperature bonding process allows the use of a broader spectrum of lead materials than conventional high temperature bonding techniques. This selection of materials includes, but is not limited to:
- Micro-structurable: direct 3D write (with laser) or UV mask expose
- Anisotropic etching enables very high aspect ratio structures
- Temperature-resistant, chemically stable, bio-compatible
Available in transparent or ceramized state:
- Indium Tin Oxide
- Aluminum etc…
The leads can be structured prior to the bonding/capping process using conventional lithographic techniques, or laser ablation, or applied on the entire interface or parts of it. Also, the leads can be structured after bonding using Invenios proprietary bonding process itself. Modifying or trimming leads after bonding allows fine tuning of embedded components like resistors, which are used in heaters or temperature sensors.
Leads can be used to:
- Apply fields to control electro wetting properties in liquid lenses, or to control electrophoresis devices
- Connect to temperature sensors and heaters
- Connect to particle counters or biological cell sensors
To avoid electrolysis of embedded fluids electrical leads or electrodes can be insulated with inorganic insulating films such as oxides or with other conformal coatings like Parylene.