Precision Micro-Fabrication in Glass

2D and 3D Microfabication

Invenios patterns channels, posts and any other planer features using a proprietary masking process and an isotropic wet etch. Alternatively, Invenios structures high aspect ratio through holes, extruded posts, and deep recesses using photostructurable glass, with microns of precision. Combining photo structural glass and our masking process, we can produce precise three dimensional features in glass, silicon,    ceramics and metals.

Dry etching/structuring

Invenios can perform DRIE, ICP or Bosch Process Etching on a large variety of materials:

  • Sub mm trench etching (Chlorine based)
  • Deep high aspect ratio etching for MEMs (Bosch)
  • Silicon oxide, nitride, carbide etching (Fluorine-based)
  • Aluminum, chrome, titanium, tungsten etching  (Chlorine-based)
  • Photoresist, BCB, polyimide ashing

 

  • Small Holes

    Microfabication
  • Small Holes

    Microfabication
  • Small Holes

    Microfabication