Void Free Copper Filled Blind Via

Plated TGVs

Metallization in Glass

Invenios is developing proprietary methods and capabilities to create metallized structures in glass such as through glass vias (TGV ) with electroplated copper. Target applications are glass interposers for 3D packaging, MEMS powered devices and sensors.

Aspect Ratio: 1:1 to 3.1
Metallization: Electrolytic Copper
Glass Thickness: 300 ┬Ám
Via Density (via/cm2): 25