In March, 2003, Invenios acquired exclusive rights from a Federally-Funded Research and Development Center (FFRDC) to commercialize and market a true 3D, microfabrication/MEMS process technology. This material was developed primarily for the creation of passive and active glass-ceramic substrates to manufacture of picosatellites and other aerospace structures. Currently, Invenios uses Photo-Structurable Glass (PSC) structure microfluidic and MEMS devices. PSG’s unique properties make it ideal for integration of electrical, optical, mechatronic, and interconnect packaging functionality.
Invenios locally exposes PSG using a direct-write process for rapid prototyping and has the capability of applying traditional flood-expose method with a photo mask for mass production. Invenios is also able to process PSG in a variety of surface finishes to meet the needs of customers such as optically transparent from fine polishing, or opaque versions from course polishing/grinding or from heat treatments.
If the UV light is applied at certain frequencies, PSG can be converted to a metasilicate material that is 30 times more etchable than the native glass material. This accelerated etch capability results in significantly steeper wall angles than other conventional wet etch techniques. By varying the development oven profile, PSG can also be ‘ceramized’ to produce various phase changes for specific light absorption, mechanical, or electronic features.
- Micro-structurable: direct 3D write (with laser) or UV mask expose
- Anisotropic etching enables very high aspect ratio structures
- Temperature-resistant, chemically stable, bio-compatible
- Available in transparent or ceramized state
- Ability to Ambient Temperature Bond PSG to other materials such as glass, metal or silicon substrates
- Thermal diffusion bonding capability of PSG to PSG without any adhesive or glue interlayers