chip with different wall angles

Semiconductor Applications

Invenios has immense multifaceted expertise in high volume custom semiconductor packaging design and sub component design. Our capabilities include:

  • Design and fabrication of high volume precision substrates for IC, LED & photonic device packaging
  • Custom wafer scale interposers for 3D packaging provide improved density, while addressing electrical and thermal constraints
  • Custom, high volume, active thermal management solutions
  • IC, LED, photonic package designers can significantly improve electrical, thermal and optical performance using our design, materials processing and custom equipment development capabilities